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| ILX128MA 5350-pixel x 6-line CCD Linear Sensor (Color) For the availability of this product, please contact the sales office. Description The ILX128MA is a reduction type CCD linear sensor developed for color image scanner, and has shutter function per each color. This sensor reads A3-size documents at a density of pseudo 800DPI, and reads A4-size at a density of pseudo 1200DPI. Features * Number of effective pixels: 32100 pixels (5350 pixels x 6) * Pixel size: 6m x 8m (8m pitch) * Distance between line: 48m (6 lines: Rsub - Rmain, Rmain - Gsub, Gsub - Gmain, Gmain - Bsub, Bsub - Bmain) * Single-sided readout * Shutter function * Ultra-high sensitivity/Ultra-low lag * Supply voltage: Single 12V power supply * Input clock pulse: CMOS 5V drive * Number of output: 3 (R, G, B) * Package: 24-pin Plastic-DIP Absolute Maximum Ratings * Supply voltage VDD * Input clock voltage * Operating temperature * Storage temperature 24 pin DIP (Plastic) Pin Configuration (Top View) 1 1 1 1 1 1 1L 1L' RS VOUT-R VOUT-G VDD 1 2 3 4 5 6 R (Sub) R (Main) G (Sub) G (Main) B (Sub) B (Main) 24 23 22 21 20 19 4 2L 3 GND VOUT-B NC 15 7 -10 to +55 -30 to +80 V V C C NC NC GND 7 8 9 18 17 16 15 14 5350 5350 5350 5350 5350 5350 13 NC VDD NC 1 ROG SHUT-R 2 10 SHUT-B 11 SHUT-G 12 Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. -1- E00462-PS Block Diagram VDD VDD 17 24 1 2 10 4 1L 1L' 2 6 Driver D41 D44 S1 S2 S3 D24 D40 S5350 Main Line (Blue) CCD register Driver 11 SHUT-B S1' S2' S3' D24' D40' D41' CCD register Driver D41 D44 S1 S2 S3 D24 D40 S5350 Main Line (Green) CCD register S5350' D44' VOUT-B 20 Sub Line (Blue) S1' S2' S3' D24' D40' D41' CCD register Driver D41 S5350 D44 S1 S2 S3 D24 D40 Main Line (Red) CCD register S5350' D44' S1' S2' S3' D24' D40' D41' S5350' D44' -2- Sub Line (Green) Sub Line (Red) CCD register 3 RS 3 2L 22 23 Driver 12 SHUT-G VOUT-G 5 Driver 13 SHUT-R VOUT-R 4 Driver Driver 15 1 14 ROG 9 21 GND GND ILX128MA Note) D24 and D24' are the start pixels for the optical black of Main Line and Sub Line. (These are not pixels immediately before multiplex.) ILX128MA Pin Description Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 Symbol 1L 1L' RS VOUT-R VOUT-G VDD NC NC GND 2 SHUT-B SHUT-G Description Clock pulse input Clock pulse input Clock pulse input Signal output (red) Signal output (green) 12V power supply NC NC GND Clock pulse input Clock pulse input Clock pulse input Pin No. 13 14 15 16 17 18 19 20 21 22 23 24 Symbol SHUT-R ROG 1 NC VDD NC NC VOUT-B GND 3 2L 4 Description Clock pulse input Clock pulse input Clock pulse input NC 12V power supply NC NC Signal output (blue) GND Clock pulse input Clock pulse input Clock pulse input Connecting to GND is recommended. Recommended Supply Voltage Item VDD Min. 11.4 Typ. 12 Max. 12.6 Unit V Input Pin Capacity Item Input capacity of 1, 2 Input capacity of 1L, 1L', 2L Input capacity of 3, 4 Input capacity of RS Input capacity of ROG Input capacity of SHUT1 Symbol C1, C2 C1L, C1L', C2L C3, C4 CRS CROG CSHUT Min. -- -- -- -- -- -- Typ. 1530 20 20 20 10 10 Max. -- -- -- -- -- -- Unit pF pF pF pF pF pF 1 SHUT represents SHUT-R, SHUT-G and SHUT-B. -3- ILX128MA Clock Frequency Item 1, 2, 1L, 1L', 2L 3, 4 RS Symbol f1, f2, f1L, f1L', f2L f3, f4 fRS Min. -- -- -- Typ. 1 2 2 Max. 3 6 6 Unit MHz MHz MHz Input Clock Voltage Condition Item 1L, 1L', 2L, 3, 4 1, 2, RS, ROG, SHUT High level Low level High leve Low level Min. 4.75 0 4.75 0 Typ. 5.0 -- 5.0 -- Max. 5.25 0.1 5.25 0.5 Unit V V V V -4- ILX128MA Electrooptical Characteristics (Note 1) (Ta = 25C, VDD = 12V, fRS = 2MHz, Input clock = 5Vp-p, Light source = 3200K, IR cut filter CM-500S (t = 1mm)) Item Red Sensitivity Green Blue Sensitivity nonuniformity Adjacent pixel difference Saturation output voltage Overflow exposure Red Saturation exposure Green Blue Dark voltage average Dark signal nonuniformity Image lag Current consumption Total transfer efficiency Output impedance Offset level Offset level difference Dynamic range Symbol RR RG RB PRNU PDF VSAT OE SER SEG SEB VDRK DSNU IL IVDD TTE ZO VOS VOS DR Min. 1.33 3.01 1.82 -- -- 2 2 x SEmin 0.8 0.4 0.6 -- -- -- -- 92 -- 4.7 -- 1000 Typ. 1.9 4.3 2.6 4 4 3 -- 1.6 0.7 1.2 0.3 1.5 0.02 32 98 250 6.2 40 10000 Max. 2.47 5.59 3.38 15 15 -- -- -- -- -- 2.0 5.0 -- 50 -- -- 7.7 200 -- Unit Remarks V/(lx * s) Note 2 % % V Note 3 Note 4 Note 5 Note 6 lx * s Note 7 mV mV % mA % V mV -- Note 8 Note 9 Note 10 -- -- -- Note 11 Note 12 Note 13 Note) 1. For each color, the black level of Main Line is defined as the average value of D24, D25 to D39, and the black level of Sub Line is defined as the average value of D24', D25' to D39'. The following electrooptical characteristics signal processing is performed. 2. For the sensitivity test light is applied with a uniform intensity of illumination. 3. PRNU is defined as indicated below. Ray incidence conditions are the same as for Note 2. VOUT = 500mV (Typ.) PRNU = (VMAX - VMIN)/2 x 100 [%] VAVE 4. Where the maximum output of the effective pixels is set to VMAX, the minimum output to VMIN and the average output to VAVE. PDF = (VMAX/VAVE) x 100 [%] Here, VAVE is defined as the average output, and VMAX, the maximum value of Vi in the range of the following pixel. Red, green, blue pixel arrangement PDF is when i = 1 to 5349. However, the definition of Vi is as follows. Vi = ABS {VOUT (i) - VOUT (i + 1)} VOUT (i) is signal output of an effective pixel (i pixel) and VOUT (i + 1) is of the adjacent pixel (i + 1 pixel). -5- ILX128MA 5. 6. 7. 8. Specifies at the minimum value of the saturation output voltage. SEmin is the exposure at the minimum value (2V) of the saturation output voltage. Saturation exposure is defined as in the right figure. SE = VSAT/R For each color, Main Line is defined by the difference between the average value of D2 to D22 dummy signal during no incident light and of D24 to D40, S1 to S5350. Sub Line is defined by the difference between the average value of D2' to D22' dummy signal during no incident light and of D24' to D40', S1' to S5350'. Optical signal integration time int stands at 10ms. 9. For each color, calculate the difference as follows; the maximum and minimum values of the dark output voltage of respective Main Line and Sub Line; the dark voltage average value of respective Main Line and Sub Line. Then, the highest value is defined as dark signal nonuniformity. Optical signal integration time int stands at 10ms. 10. VOUT = 500mV (Typ.) 11. Vos is defined as the output DC value when RS is high. 12. For each color, the Main Line offset level of the optical black pixel is defined as Vos-main, the Sub Line offset level, Vos-sub. Then, the offset level difference is defined as indicated below. VOS = | VOS-main - VOS-sub | 1L and 1L' are set to the same clock input. Vos 13. Dynamic range is defined as follows. DR = VSAT/VDRK When the optical signal integration time is shorter, the dynamic range gets wider because the optical signal integration time is in proportion to the dark voltage. -6- Clock Timing Chart 1 ROG 2 2 3 D1' D2 D1 4 5 0 1, 1L 1L' 5 2, 2L 0 5 0 3 5 0 4 5 0 RS 5 0 1 1 D23 D23' D24 D24' D40 D40' S1 S1' S5349' S5350 S5350' D41 D41' D43' D44 Dummy signal (4 pixels x 2) VOUT Optical black (16 pixels x 2) Dummy signal (30 pixels + 25 pixels x 2) Effective pixel signal (5350 pixels x 2) D44' -7- 1-line output period (5394 pixels x 2) Note) The transfer pulse 1, 2, 1L, 1L' and 2L must have more than 5394 cycles. 3 and 4 must have more than 10788 cycles. ILX128MA Clock Timing Chart 2 (shutter operation) ROG 2 2 3 4 5 0 1, 1L 1L' 5 2, 2L 0 5 0 3 5 -8- 0 4 5 0 RS 5 SHUT 0 5 0 Integration time ILX128MA Note) Shutter pulse must not be high to low level or low to high level during effective pixel period. 1 1 ILX128MA Clock Timing Chart 3 t4 t5 ROG t6 1 2 t7 t6 t1 t2 t7 t3 Clock Timing Chart 4 t7 1 t6 2 t9 1L 1L' 2L t15 t11 3 t10 t18 t16 t19 t8 t7 t6 t8 t9 RS VOUT 1 and 2 Cross Point 1 2 5V 0V 1.5V or more 1.5V or more 3 and 4 Cross Point 3 4 5V 0V 1.5V or more 1.5V or more , , t10 t11 t12 t13 t17 t14 t21 t22 t20 Main Line Sub Line 4 -9- ILX128MA Clock Pulse Recommended Timing Item ROG, 1 pulse timing ROG pulse high level period ROG, 1 pulse timing ROG pulse rise time ROG pulse fall time 1 pulse rise/2 pulse fall time 1 pulse fall/2 pulse rise time 1L, 1L' pulse rise/2L pulse fall time 1L, 1L' pulse fall/2L pulse rise time 3 pulse rise/4 pulse fall time 3 pulse fall/4 pulse rise time RS pulse rise time RS pulse fall time RS pulse high level period 1L', 2L - 3, 4 pulse timing 1 1L', 2L - 3, 4 pulse timing 2 RS, 3 pulse timing 3, 4 pulse low level period Symbol t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 t12 t13 t14 t15 t16 t17 t18 t19 t20 Signal output delay time t21 t22 The recommended duty of 1, 2, 1L, 2L, 3 and 4 = 50%. 1 These timing is the recommended condition under fRS = 2MHz. Min. 50 1200 1200 0 0 0 0 0 0 0 0 0 0 20 35 35 50 35 35 -- -- -- Typ. 100 1500 1500 5 5 20 20 10 10 10 10 10 10 2501 40 2101 1251 250 250 35 8 35 Max. -- -- -- 10 10 60 60 301 301 301 301 301 301 -- -- -- -- -- -- -- -- -- Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns - 10 - ILX128MA Application Circuit1 4 IC2 2L 3 1 ROG 5.1k VOUT-B 10 Tr1 IC1 2 100 SHUT-R IC2 100 10 10 10 24 4 23 2L 22 3 21 GND 20 VOUT-B 19 NC 18 NC 17 VDD 16 NC 15 1 14 ROG SHUT-B 11 100 13 SHUT-R SHUT-G 12 100 IC2 SHUT-G IC1: 74AC04 IC2: 74HC04 Tr1: 2SC2785 VOUT-R VOUT-G RS 1L' 1L GND 9 IC1 VDD NC NC 12V 1 2 3 4 5 6 7 8 2 0.1F 47F/ 10 16V IC2 Tr1 1L 1L' RS VOUT-R 5.1k Tr1 VOUT-G 5.1k 2 10 10 10 10 2 10 SHUT-B 1 Data rate fRS = 2MHz Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same. - 11 - ILX128MA Example of Representative Characteristics (VDD = 12V, Ta = 25C) Spectral sensitivity characteristics (Standard characteristics) 1 0.8 0.6 0.4 0.2 0 400 Relative sensitivity 450 500 550 600 Wavelength [nm] 650 700 Dark signal output temperature characteristics (Standard characteristics) Integration time output voltage characteristics (Standard characteristics) 10 5 Output voltage rate Output voltage rate 10 20 60 1 1 0.5 0.5 0.1 0 30 40 50 0.1 1 5 int - Integration time [ms] 10 Ta - Ambient temperature [C] Offset level vs. VDD characteristics (Standard characteristics) 12 Ta = 25C 10 Vos - Offset level [V] Vos - Offset level [V] Offset level vs. temperature characteristics (Standard characteristics) 12 10 8 8 6 6 4 Vos 0.1 VDD 4 Vos 8mV/C Ta 2 2 0 11.4 12 VDD [V] 12.6 0 0 10 20 30 40 50 60 Ta - Ambient temperature [C] - 12 - ILX128MA Notes on Handling 1. Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non-chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensors. e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges. 2) Notes on Handling CCD Packages The following points should be observed when handling and installing plastic packages. a) Remain within the following limits when applying static load to the package. (1) Compressive strength: 39N/surface (Do not apply load more than 0.7mm inside the outer perimeter of the glass portion.) (2) Shearing strength: 29N/surface (3) Tensile strength: 29N/surface (4) Torsional strength: 0.9Nm Cover glass , , , Plastic portion 39N 29N 29N 0.9Nm Ceramic portion (1) Adhesive (2) (3) (4) , b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the ceramic portion. Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive. c) Be aware that any of the following can cause the package to crack or dust to be generated. (1) Applying repetitive bending stress to the external leads. (2) Applying heat to the external leads for an extended period of time with soldering iron. (3) Rapid cooling or heating. (4) Prying the plastic portion and ceramic portion away at a support point of the adhesive layer. (5) Applying the metal a crash or a rub against the plastic portion. Note that the preceding notes should also be observed when removing a component from a board after it has already been soldered. d) The notch of the plastic portion is used for directional index, and that can not be used for reference of fixing. In addition, the cover glass and seal resin may overlap with the notch or ceramic may overlap with the notch of the plastic portion. 3. Soldering a) Make sure the package temperature does not exceed 80C. b) Use a grounded 30W soldering iron and solder each pin in less than 2 seconds. For repairs and remount, cool sufficiently. c) To dismount an image sensor, do not use solder suction equipment. When using an electric desoldering tool, ground the controller. For the temperature control system, use a zero-cross type. - 13 - ILX128MA 4. Dust and dirt protection a) Operate in clean environments. b) Do not either touch mirror surfaces by hand or have any object come in contact with mirror surfaces. Should dirt stick to a mirror surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the mirror surfaces are grease stained. Be careful not to scratch the mirror surfaces. d) Keep in a case to protect from dust and dirt. To prevent dew condensation on the mirror surfaces, preheat or precool when moving to a room with great temperature differences. 5. Exposure to high temperatures or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. 6. CCD image sensors are precise optical equipment that should not be subject to mechanical shocks. - 14 - Package Outline Unit: mm 24pin SDIP(400mil) 55.7 0.3 24 13 10.0 0.3 4.0 0.5 5.0 0.3 1 12 0.3 M 1. The height from the bottom to the sensor surface is 2.38 0.3mm. 2. The thickness of the cover glass is 0.7mm, and the refractive index is 1.5. PACKAGE STRUCTURE PACKAGE MATERIAL Plastic-Ceramic LEAD TREATMENT GOLD PLATING LEAD MATERIAL 42ALLOY PACKAGE MASS 5.43g Sony Corporation DRAWING NUMBER LS-B27(E) 4.28 0.5 1.778 5.334 0.46 3.58 0.25 H No.1Pixel (Green(main line)) 10.16 V 0 to 9 7.6 0.3 42.8(8mX5350pixels) - 15 - ILX128MA |
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